NSN 5962-00-236-9906 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962002369906 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 002369906 |
| NCB Code: USA (00) |
| Manufacturers: Texas Instrument Inc , Boeing Company , Dne Technologies Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UA709CJ-00, UA709CJ, SN72709J-00, SN72709J, 477-1577-003 under NSN 5962-00-236-9906 of Microcircuit Linear manufactured by Texas Instrument Inc, Boeing Company, Dne Technologies Inc.
Federal Supply Class of NSN 5962-00-236-9906 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-236-9906, 5962002369906
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Part No Manufacturer Item Name QTY RFQ UA709CJ-00 Texas Instrument Inc microcircuit linear Avl RFQ UA709CJ Texas Instrument Inc microcircuit linear Avl RFQ SN72709J-00 Texas Instrument Inc microcircuit linear Avl RFQ SN72709J Texas Instrument Inc microcircuit linear Avl RFQ 477-1577-003 Boeing Company microcircuit linear Avl RFQ 40007178-000 Dne Technologies Inc microcircuit linear Avl RFQ
Characteristics Data of NSN 5962002369906MRC Criteria Characteristic ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 300.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED W/COMMON MODE AND HERMETICALLY SEALED AND HIGH IMPEDANCE AND LOW DRIFT AND EXTERNALLY COMPENSATED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 4 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE CTFT CASE OUTLINE SOURCE AND DESIGNATOR TO-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | W/COMMON MODE AND HERMETICALLY SEALED AND HIGH IMPEDANCE AND LOW DRIFT AND EXTERNALLY COMPENSATED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 4 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | TO-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |