NSN 5962-00-248-2671 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962002482671 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 002482671 |
| NCB Code: USA (00) |
| Manufacturers: Sprague Electric Co World Hqs , Philips Semiconductors Inc , Dla Land And Maritime , Tadiran Ltd , Rockwell Collins Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SE8480J, S8480W, S8480J, DMS 84068B, DMS 80015B under NSN 5962-00-248-2671 of Microcircuit Digital manufactured by Sprague Electric Co World Hqs, Philips Semiconductors Inc, Dla Land And Maritime, Tadiran Ltd, Rockwell Collins Inc.
Federal Supply Class of NSN 5962-00-248-2671 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-248-2671, 5962002482671
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Part No Manufacturer Item Name QTY RFQ SE8480J Sprague Electric Co World Hqs microcircuit digital Avl RFQ S8480W Philips Semiconductors Inc microcircuit digital Avl RFQ S8480J Philips Semiconductors Inc microcircuit digital Avl RFQ DMS 84068B Dla Land And Maritime microcircuit digital Avl RFQ DMS 80015B Dla Land And Maritime microcircuit digital Avl RFQ 5921003 Tadiran Ltd microcircuit digital Avl RFQ 351-7332-060 Rockwell Collins Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962002482671MRC Criteria Characteristic ADAQ BODY LENGTH 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 67.2 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND LOW POWER AND MONOLITHIC AND POSITIVE OUTPUTS AND W/TOTEM POLE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM EMITTER-COUPLED LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-88 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 67.2 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER AND MONOLITHIC AND POSITIVE OUTPUTS AND W/TOTEM POLE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | EMITTER-COUPLED LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-88 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |