NSN 5962-00-252-4920 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962002524920 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 002524920 |
| NCB Code: USA (00) |
| Manufacturers: Nokia Siemens Networks Gmbh And Co , Fairchild Semiconductor Corp , Adelco Elektronik Gmbh , National Semiconductor Corp , Lacon Electronic Gmbh , Raytheon Aircraft , Allis Chalmers Corp , Thales Communications Inc , Lh Enterprise |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers V22916-X5-A11, UA748HC, LM748CHA, LM748CH, 535150-9 under NSN 5962-00-252-4920 of Microcircuit Linear manufactured by Nokia Siemens Networks Gmbh And Co, Fairchild Semiconductor Corp, Adelco Elektronik Gmbh, National Semiconductor Corp, Lacon Electronic Gmbh.
Federal Supply Class of NSN 5962-00-252-4920 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-252-4920, 5962002524920
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Part No Manufacturer Item Name QTY RFQ V22916-X5-A11 Nokia Siemens Networks Gmbh And Co microcircuit linear Avl RFQ UA748HC Fairchild Semiconductor Corp microcircuit linear Avl RFQ LM748CHA Adelco Elektronik Gmbh microcircuit linear Avl RFQ LM748CH Adelco Elektronik Gmbh microcircuit linear Avl RFQ LM748CH National Semiconductor Corp microcircuit linear Avl RFQ LM748CH Lacon Electronic Gmbh microcircuit linear Avl RFQ 535150-9 Raytheon Aircraft microcircuit linear Avl RFQ 45-0020-01 Allis Chalmers Corp microcircuit linear Avl RFQ 115072-0001 Thales Communications Inc microcircuit linear Avl RFQ 076-20130-041 Lh Enterprise microcircuit linear Avl RFQ
Characteristics Data of NSN 5962002524920MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH GAIN AND LOW POWER AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 2 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 300.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH GAIN AND LOW POWER AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |