NSN 5962-00-370-0419 of Microcircuit Digital - Parts Details
Alternative NSN: 5962003700419 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 003700419 |
NCB Code: USA (00) |
Manufacturers: Texas Instrument Inc , Philips Semiconductors Inc , Freescale Semiconductor Inc , Fairchild Semiconductor Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNC54H00W, S54H00W 883B, RB54H00W, MC3100FH2, HL50730 under NSN 5962-00-370-0419 of Microcircuit Digital manufactured by Texas Instrument Inc, Philips Semiconductors Inc, Freescale Semiconductor Inc, Fairchild Semiconductor Corp.
Federal Supply Class of NSN 5962-00-370-0419 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-370-0419, 5962003700419
-
Part No Manufacturer Item Name QTY RFQ SNC54H00W Texas Instrument Inc microcircuit digital Avl RFQ S54H00W 883B Philips Semiconductors Inc microcircuit digital Avl RFQ RB54H00W Philips Semiconductors Inc microcircuit digital Avl RFQ MC3100FH2 Freescale Semiconductor Inc microcircuit digital Avl RFQ HL50730 Fairchild Semiconductor Corp microcircuit digital Avl RFQ 9H00FMQB Fairchild Semiconductor Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962003700419MRC Criteria Characteristic ADAQ BODY LENGTH 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 88.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND POSITIVE OUTPUTS AND DARLINGTON-CONNECTED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CZEQ TIME RATING PER CHACTERISTIC 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT PMLC PRECIOUS MATERIAL AND LOCATION TERMINALS GOLD PRMT PRECIOUS MATERIAL GOLD TEST TEST DATA DOCUMENT 96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 88.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND POSITIVE OUTPUTS AND DARLINGTON-CONNECTED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CZEQ | TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
PRMT | PRECIOUS MATERIAL | GOLD |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |