NSN 5962-00-619-1078 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962006191078 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 006191078 |
| NCB Code: USA (00) |
| Manufacturers: Texas Instrument Inc , Microsemi Corporation , National Semiconductor Corp , Arma Div Ambac Industries Inc , Edo Corporation , Be Aerospace Consumables Management |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNC55325J-00, SNC55325J, SN75325J, SG55325J 883, DS55325J 883B under NSN 5962-00-619-1078 of Microcircuit Linear manufactured by Texas Instrument Inc, Microsemi Corporation, National Semiconductor Corp, Arma Div Ambac Industries Inc, Edo Corporation.
Federal Supply Class of NSN 5962-00-619-1078 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-619-1078, 5962006191078
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Part No Manufacturer Item Name QTY RFQ SNC55325J-00 Texas Instrument Inc microcircuit linear Avl RFQ SNC55325J Texas Instrument Inc microcircuit linear Avl RFQ SN75325J Texas Instrument Inc microcircuit linear Avl RFQ SG55325J 883 Microsemi Corporation microcircuit linear Avl RFQ DS55325J 883B National Semiconductor Corp microcircuit linear Avl RFQ 7-62529-001 Arma Div Ambac Industries Inc microcircuit linear Avl RFQ 507624-281 Edo Corporation microcircuit linear Avl RFQ 431-068-9302 Be Aerospace Consumables Management microcircuit linear Avl RFQ
Characteristics Data of NSN 5962006191078MRC Criteria Characteristic ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STROBE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 8 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 DRIVER, MEMORY CORE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STROBE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 DRIVER, MEMORY CORE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |