NSN 5962-00-628-6185 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962006286185 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 006286185 |
| NCB Code: USA (00) |
| Manufacturers: Selex Elsag Ltd , G E C Marconi Communications Ltd , Intersil Corporation , Rohde And Schwarz Inc , Selex Galileo Ltd , Agilent Technologies Inc , Hewlett Packard Co , Telcom Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SS60026-1, HA2-2625-5, HA2-2625-005, HA2-2622-2, 4917020 under NSN 5962-00-628-6185 of Microcircuit Linear manufactured by Selex Elsag Ltd, G E C Marconi Communications Ltd, Intersil Corporation, Rohde And Schwarz Inc, Selex Galileo Ltd.
Federal Supply Class of NSN 5962-00-628-6185 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-628-6185, 5962006286185
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Part No Manufacturer Item Name QTY RFQ SS60026-1 Selex Elsag Ltd microcircuit linear Avl RFQ SS60026-1 G E C Marconi Communications Ltd microcircuit linear Avl RFQ HA2-2625-5 Intersil Corporation microcircuit linear Avl RFQ HA2-2625-005 Intersil Corporation microcircuit linear Avl RFQ HA2-2622-2 Intersil Corporation microcircuit linear Avl RFQ 4917020 Rohde And Schwarz Inc microcircuit linear Avl RFQ 28611-00346 Selex Galileo Ltd microcircuit linear Avl RFQ 1826-0079 Agilent Technologies Inc microcircuit linear Avl RFQ 1826-0079 Hewlett Packard Co microcircuit linear Avl RFQ 1321 Telcom Semiconductor Inc microcircuit linear Avl RFQ
Characteristics Data of NSN 5962006286185MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 300.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND HIGH GAIN AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND ADJUSTABLE CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE AND 1 AMPLIFIER, WIDEBAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT GOLD CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT PMLC PRECIOUS MATERIAL AND LOCATION TERMINALS GOLD
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND HIGH GAIN AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND ADJUSTABLE |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE AND 1 AMPLIFIER, WIDEBAND |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |