NSN 5962-00-816-8858 of Microcircuit Digital - Parts Details
Alternative NSN: 5962008168858 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 008168858 |
NCB Code: USA (00) |
Manufacturers: Texas Instrument Inc , Halliburton Geophysical Services Inc , Philips Semiconductors Inc , Sprague Electric Co World Hqs , Honeywell International Inc , Facit Ab Eack |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN7410J, SN7410, NE8870J, 1996487-1, 10-592-010-00 under NSN 5962-00-816-8858 of Microcircuit Digital manufactured by Texas Instrument Inc, Halliburton Geophysical Services Inc, Philips Semiconductors Inc, Sprague Electric Co World Hqs, Honeywell International Inc.
Federal Supply Class of NSN 5962-00-816-8858 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-816-8858, 5962008168858
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Part No Manufacturer Item Name QTY RFQ SN7410J Texas Instrument Inc microcircuit digital Avl RFQ SN7410 Texas Instrument Inc microcircuit digital Avl RFQ SN7410 Halliburton Geophysical Services Inc microcircuit digital Avl RFQ NE8870J Philips Semiconductors Inc microcircuit digital Avl RFQ NE8870J Sprague Electric Co World Hqs microcircuit digital Avl RFQ 1996487-1 Honeywell International Inc microcircuit digital Avl RFQ 10-592-010-00 Facit Ab Eack microcircuit digital Avl RFQ
Characteristics Data of NSN 5962008168858MRC Criteria Characteristic ADAQ BODY LENGTH 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.062 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS AFGA OPERATING TEMP RANGE -0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION H-46 HELO CBBL FEATURES PROVIDED HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN TRIPLE 3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 3 GATE, NAND
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.350 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.260 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.062 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -0.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | H-46 HELO |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED |
CQSJ | INCLOSURE MATERIAL | GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 3 GATE, NAND |