NSN 5962-00-828-9524 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962008289524 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 008289524 |
| NCB Code: USA (00) |
| Manufacturers: Lansdale Semiconductor Inc , Philips Semiconductors Inc , Ail Systems Inc , Microwave Engineering Corporation , Sierra Networks Inc Sierracom Di |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SL150I1, SE150G, 77C804-002, 0073-543P1 under NSN 5962-00-828-9524 of Microcircuit Digital manufactured by Lansdale Semiconductor Inc, Philips Semiconductors Inc, Ail Systems Inc, Microwave Engineering Corporation, Sierra Networks Inc Sierracom Di.
Federal Supply Class of NSN 5962-00-828-9524 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-828-9524, 5962008289524
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Part No Manufacturer Item Name QTY RFQ SL150I1 Lansdale Semiconductor Inc microcircuit digital Avl RFQ SE150G Philips Semiconductors Inc microcircuit digital Avl RFQ SE150G Lansdale Semiconductor Inc microcircuit digital Avl RFQ 77C804-002 Ail Systems Inc microcircuit digital Avl RFQ 0073-543P1 Microwave Engineering Corporation microcircuit digital Avl RFQ 0073-543P1 Sierra Networks Inc Sierracom Di microcircuit digital Avl RFQ
Characteristics Data of NSN 5962008289524MRC Criteria Characteristic ADAQ BODY LENGTH 0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 72.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM DIODE-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 DRIVER, LINE CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 10 FLAT LEADS CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 72.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 DRIVER, LINE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 10 FLAT LEADS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |