NSN 5962-00-985-2181 of Microcircuit Memory - Parts Details
Alternative NSN: 5962009852181 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 009852181 |
NCB Code: USA (00) |
Manufacturers: Dla Land And Maritime , Harris Corporation , Intersil Corporation , Texas Instrument Inc , Raytheon Electronic Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 055, RM1-0186-5, HM1-0186-5, DM109, 3300-46004-1 under NSN 5962-00-985-2181 of Microcircuit Memory manufactured by Dla Land And Maritime, Harris Corporation, Intersil Corporation, Texas Instrument Inc, Raytheon Electronic Systems Inc.
Federal Supply Class of NSN 5962-00-985-2181 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-985-2181, 5962009852181
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 055 Dla Land And Maritime microcircuit memory Avl RFQ RM1-0186-5 Harris Corporation microcircuit memory Avl RFQ RM1-0186-5 Intersil Corporation microcircuit memory Avl RFQ HM1-0186-5 Intersil Corporation microcircuit memory Avl RFQ DM109 Texas Instrument Inc microcircuit memory Avl RFQ 3300-46004-1 Intersil Corporation microcircuit memory Avl RFQ 3300-46004-1 Raytheon Electronic Systems Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962009852181MRC Criteria Characteristic ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 450.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM CURRENT-MODE LOGIC CQZP INPUT CIRCUIT PATTERN 8 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 20.0 VOLTS MINIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | CURRENT-MODE LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MINIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |