NSN 5962-01-015-0275 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010150275 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010150275 |
| NCB Code: USA (01) |
| Manufacturers: Intersil Corporation , Siliconix Incorporated Div Silic , Bae Systems |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ITS 70224, DG116AP-2, DG116AP 883B, 310336P2 under NSN 5962-01-015-0275 of Microcircuit Linear manufactured by Intersil Corporation, Siliconix Incorporated Div Silic, Bae Systems.
Federal Supply Class of NSN 5962-01-015-0275 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-015-0275, 5962010150275
Characteristics Data of NSN 5962010150275MRC Criteria Characteristic ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 750.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/FIELD EFFECT TRANSISTOR SWITCH CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 4 CHANNEL CSSL DESIGN FUNCTION AND QUANTITY 1 DRIVER, SWITCH, FIELD EFFECT TRANSISTOR CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 2.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 750.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/FIELD EFFECT TRANSISTOR SWITCH |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 4 CHANNEL |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 DRIVER, SWITCH, FIELD EFFECT TRANSISTOR |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 2.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |