NSN 5962-01-016-5316 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962010165316 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010165316 |
| NCB Code: USA (01) |
| Manufacturers: Nokia Siemens Networks Gmbh And Co , Freescale Semiconductor Inc , Te Connectivity |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers V22916-X4-A73, MC14519CL, MC14519BCL, 002 4161 135499 under NSN 5962-01-016-5316 of Microcircuit Digital manufactured by Nokia Siemens Networks Gmbh And Co, Freescale Semiconductor Inc, Te Connectivity.
Federal Supply Class of NSN 5962-01-016-5316 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-016-5316, 5962010165316
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Part No Manufacturer Item Name QTY RFQ V22916-X4-A73 Nokia Siemens Networks Gmbh And Co microcircuit digital Avl RFQ MC14519CL Freescale Semiconductor Inc microcircuit digital Avl RFQ MC14519BCL Freescale Semiconductor Inc microcircuit digital Avl RFQ 002 4161 135499 Te Connectivity microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010165316MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND LOW POWER CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CZEQ TIME RATING PER CHACTERISTIC 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CZEQ | TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |