NSN 5962-01-018-4640 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010184640 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010184640 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc , General Dynamics Information Systemes , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers LH2940, AM685HL, AM685 BIC, AM685 BIA, 85600800-08 under NSN 5962-01-018-4640 of Microcircuit Linear manufactured by Advanced Micro Devices Inc, General Dynamics Information Systemes, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-018-4640 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-018-4640, 5962010184640
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Part No Manufacturer Item Name QTY RFQ LH2940 Advanced Micro Devices Inc microcircuit linear Avl RFQ AM685HL Advanced Micro Devices Inc microcircuit linear Avl RFQ AM685 BIC Advanced Micro Devices Inc microcircuit linear Avl RFQ AM685 BIA Advanced Micro Devices Inc microcircuit linear Avl RFQ 85600800-08 General Dynamics Information Systemes microcircuit linear Avl RFQ 725000-188 Raytheon Aircraft microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010184640MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND W/OPEN COLLECTOR AND HIGH SPEED AND NEGATIVE OUTPUTS CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 COMPARATOR, VOLTAGE, DIFFERENTIAL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 5.50 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 5.50 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 12.00 TEST TEST DATA DOCUMENT 97942-581R709 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW TTQY TERMINAL TYPE AND QUANTITY 10 PIN
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND W/OPEN COLLECTOR AND HIGH SPEED AND NEGATIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 3 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COMPARATOR, VOLTAGE, DIFFERENTIAL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 5.50 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 5.50 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 12.00 |
| TEST | TEST DATA DOCUMENT | 97942-581R709 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW |
| TTQY | TERMINAL TYPE AND QUANTITY | 10 PIN |