NSN 5962-01-026-0495 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010260495 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010260495 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Intel Corp Sales Office |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 021, 3601 under NSN 5962-01-026-0495 of Microcircuit Memory manufactured by Dla Land And Maritime, Intel Corp Sales Office.
Federal Supply Class of NSN 5962-01-026-0495 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-026-0495, 5962010260495
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 021 Dla Land And Maritime microcircuit memory Avl RFQ 3601 Intel Corp Sales Office microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010260495MRC Criteria Characteristic ADAQ BODY LENGTH 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM ADAU BODY HEIGHT 0.160 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 512.0 MILLIWATTS AFGA OPERATING TEMP RANGE -65.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+160.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND EXPANDABLE AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR AND HIGH SPEED AND W/OPEN COLLECTOR CQSJ INCLOSURE MATERIAL CERAMIC AND METAL CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.0 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.160 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 512.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+160.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND EXPANDABLE AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR AND HIGH SPEED AND W/OPEN COLLECTOR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |