NSN 5962-01-034-3866 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010343866 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010343866 |
| NCB Code: USA (01) |
| Manufacturers: National Semiconductor Corp , Harris Corporation , Intersil Corporation , Itt Cannon , Hewlett Packard Co , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers LM3028BH883B, CA3028BT3, CA3028BS3, 2139712G001, 1820-0306 under NSN 5962-01-034-3866 of Microcircuit Linear manufactured by National Semiconductor Corp, Harris Corporation, Intersil Corporation, Itt Cannon, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-034-3866 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-034-3866, 5962010343866
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Part No Manufacturer Item Name QTY RFQ LM3028BH883B National Semiconductor Corp microcircuit linear Avl RFQ CA3028BT3 Harris Corporation microcircuit linear Avl RFQ CA3028BS3 Intersil Corporation microcircuit linear Avl RFQ 2139712G001 Itt Cannon microcircuit linear Avl RFQ 1820-0306 Hewlett Packard Co microcircuit linear Avl RFQ 115223-0003 Thales Communications Inc microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010343866MRC Criteria Characteristic ADAQ BODY LENGTH 0.110 INCHES NOMINAL ADAR BODY OUTSIDE DIAMETER 0.343 INCHES NOMINAL AEHX MAXIMUM POWER DISSIPATION RATING 450.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, DIFFERENTIAL CTFT CASE OUTLINE SOURCE AND DESIGNATOR TO-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN FEAT SPECIAL FEATURES DUAL-IN-LINE FORMED LEADS TEST TEST DATA DOCUMENT 81349-MIL-STD-883 CONDITION B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.110 INCHES NOMINAL |
| ADAR | BODY OUTSIDE DIAMETER | 0.343 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, DIFFERENTIAL |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | TO-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| FEAT | SPECIAL FEATURES | DUAL-IN-LINE FORMED LEADS |
| TEST | TEST DATA DOCUMENT | 81349-MIL-STD-883 CONDITION B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |