NSN 5962-01-067-4649 of Microcircuit Digital - Parts Details
Alternative NSN: 5962010674649 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010674649 |
NCB Code: USA (01) |
Manufacturers: Fairchild Semiconductor Corp , National Semiconductor Corp , Thales Training And Simulation Inc , Eaton Corp , Thales Communications Inc , L 3 Communications |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers F4075BPC, CD4075BMJ883B, CD4075BCJ, 57660076D, 4075BDMQB under NSN 5962-01-067-4649 of Microcircuit Digital manufactured by Fairchild Semiconductor Corp, National Semiconductor Corp, Thales Training And Simulation Inc, Eaton Corp, Thales Communications Inc.
Federal Supply Class of NSN 5962-01-067-4649 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-067-4649, 5962010674649
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Part No Manufacturer Item Name QTY RFQ F4075BPC Fairchild Semiconductor Corp microcircuit digital Avl RFQ CD4075BMJ883B National Semiconductor Corp microcircuit digital Avl RFQ CD4075BCJ National Semiconductor Corp microcircuit digital Avl RFQ 57660076D Thales Training And Simulation Inc microcircuit digital Avl RFQ 4075BDMQB Fairchild Semiconductor Corp microcircuit digital Avl RFQ 143503552 Eaton Corp microcircuit digital Avl RFQ 115227-0006 Thales Communications Inc microcircuit digital Avl RFQ 046-97-00276 L 3 Communications microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010674649MRC Criteria Characteristic ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.780 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN TRIPLE 3 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CZEQ TIME RATING PER CHACTERISTIC 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.780 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |