NSN 5962-01-090-9756 of Microcircuit Linear - Parts Details
Alternative NSN: 5962010909756 |
Item Name: Microcircuit Linear |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010909756 |
NCB Code: USA (01) |
Manufacturers: Boeing Company , Intersil Corporation , Siliconix Incorporated Div Silic , Racal Survey Inc Div Of Racal Da , Thales Uk Limited , Astronautics Corporation Of America , Honeywell Aerospace |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers VE477-5037-0001, IH5043MJE 883B, IH5043CDE, HI1-5043-8, HI1 5043 883 under NSN 5962-01-090-9756 of Microcircuit Linear manufactured by Boeing Company, Intersil Corporation, Siliconix Incorporated Div Silic, Racal Survey Inc Div Of Racal Da, Thales Uk Limited.
Federal Supply Class of NSN 5962-01-090-9756 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-090-9756, 5962010909756
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Part No Manufacturer Item Name QTY RFQ VE477-5037-0001 Boeing Company microcircuit linear Avl RFQ IH5043MJE 883B Intersil Corporation microcircuit linear Avl RFQ IH5043CDE Intersil Corporation microcircuit linear Avl RFQ HI1-5043-8 Intersil Corporation microcircuit linear Avl RFQ HI1 5043 883 Intersil Corporation microcircuit linear Avl RFQ HI-1D-5043-8 Intersil Corporation microcircuit linear Avl RFQ DG5043AK 883 Siliconix Incorporated Div Silic microcircuit linear Avl RFQ 1862405 Racal Survey Inc Div Of Racal Da microcircuit linear Avl RFQ 1862405 Thales Uk Limited microcircuit linear Avl RFQ 17527-001 Astronautics Corporation Of America microcircuit linear Avl RFQ 1282V033 Honeywell Aerospace microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010909756MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM ADAT BODY WIDTH 0.260 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 450.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND HIGH CURRENT AND HIGH GAIN AND BIPOLAR CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 2 CHANNEL CSSL DESIGN FUNCTION AND QUANTITY 2 SWITCH, ANALOG CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 15.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 280.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 370.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.260 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND HIGH CURRENT AND HIGH GAIN AND BIPOLAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 2 CHANNEL |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 SWITCH, ANALOG |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 280.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 370.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |