NSN 5962-01-094-1266 of Microcircuit Digital - Parts Details
Alternative NSN: 5962010941266 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010941266 |
NCB Code: USA (01) |
Manufacturers: Freescale Semiconductor Inc , Rca Corp , National Semiconductor Corp , Eaton Corp , Thales Communications Inc , L 3 Communications , Simmonds Precision Products Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MC14082BBCBS, CD4082BF3, CD4082BCJ, 143503555, 115237-0009 under NSN 5962-01-094-1266 of Microcircuit Digital manufactured by Freescale Semiconductor Inc, Rca Corp, National Semiconductor Corp, Eaton Corp, Thales Communications Inc.
Federal Supply Class of NSN 5962-01-094-1266 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-094-1266, 5962010941266
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Part No Manufacturer Item Name QTY RFQ MC14082BBCBS Freescale Semiconductor Inc microcircuit digital Avl RFQ CD4082BF3 Rca Corp microcircuit digital Avl RFQ CD4082BCJ National Semiconductor Corp microcircuit digital Avl RFQ 143503555 Eaton Corp microcircuit digital Avl RFQ 115237-0009 Thales Communications Inc microcircuit digital Avl RFQ 046-97-00358 L 3 Communications microcircuit digital Avl RFQ 033863-3 Simmonds Precision Products Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010941266MRC Criteria Characteristic ADAQ BODY LENGTH 18.93 MILLIMETERS MINIMUM AND 19.55 MILLIMETERS MAXIMUM ADAT BODY WIDTH 6.10 MILLIMETERS MINIMUM AND 6.60 MILLIMETERS MAXIMUM ADAU BODY HEIGHT 3.94 MILLIMETERS MINIMUM AND 5.08 MILLIMETERS MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND HIGH VOLTAGE AND MEDIUM SPEED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-OXIDIZED-SILICON LOGIC CQZP INPUT CIRCUIT PATTERN DUAL 4 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 GATE, AND CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 18.93 MILLIMETERS MINIMUM AND 19.55 MILLIMETERS MAXIMUM |
ADAT | BODY WIDTH | 6.10 MILLIMETERS MINIMUM AND 6.60 MILLIMETERS MAXIMUM |
ADAU | BODY HEIGHT | 3.94 MILLIMETERS MINIMUM AND 5.08 MILLIMETERS MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH VOLTAGE AND MEDIUM SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-OXIDIZED-SILICON LOGIC |
CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, AND |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |