NSN 5962-01-120-0550 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011200550 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011200550 |
| NCB Code: USA (01) |
| Manufacturers: Semiconductor Components Industrial , On Semiconductors , Freescale Semiconductor Inc , The Boeing Company , Rockwell Collins Inc , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers S6810M, MCM6810CJBA, MCM6810BJCA, MCM6810BJBS, 935088-1 under NSN 5962-01-120-0550 of Microcircuit Memory manufactured by Semiconductor Components Industrial, On Semiconductors, Freescale Semiconductor Inc, The Boeing Company, Rockwell Collins Inc.
Federal Supply Class of NSN 5962-01-120-0550 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-120-0550, 5962011200550
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Part No Manufacturer Item Name QTY RFQ S6810M Semiconductor Components Industrial microcircuit memory Avl RFQ MCM6810CJBA On Semiconductors microcircuit memory Avl RFQ MCM6810CJBA Freescale Semiconductor Inc microcircuit memory Avl RFQ MCM6810BJCA Freescale Semiconductor Inc microcircuit memory Avl RFQ MCM6810BJBS Freescale Semiconductor Inc microcircuit memory Avl RFQ 935088-1 The Boeing Company microcircuit memory Avl RFQ 351-8399-030 Rockwell Collins Inc microcircuit memory Avl RFQ 10133845 Paeaeesikunta Logistiikkaosasto microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011200550MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION AN/ARC RADIO 29778 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 22 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-3 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | AN/ARC RADIO 29778 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |