NSN 5962-01-138-4164 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962011384164 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011384164 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Harris Corporation , Bae Systems , Selex Galileo Ltd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers CD4009UBF3A, CD4009UBF-3, 28631-06907 under NSN 5962-01-138-4164 of Microcircuit Digital manufactured by Texas Instrument Inc, Harris Corporation, Bae Systems, Selex Galileo Ltd.
Federal Supply Class of NSN 5962-01-138-4164 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-138-4164, 5962011384164
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Part No Manufacturer Item Name QTY RFQ CD4009UBF3A Texas Instrument Inc microcircuit digital Avl RFQ CD4009UBF3A Harris Corporation microcircuit digital Avl RFQ CD4009UBF-3 Harris Corporation microcircuit digital Avl RFQ 28631-06907 Bae Systems microcircuit digital Avl RFQ 28631-06907 Selex Galileo Ltd microcircuit digital Avl RFQ
Characteristics Data of NSN 5962011384164MRC Criteria Characteristic ADAQ BODY LENGTH 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HIGH CURRENT AND HIGH VOLTAGE AND HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN HEX 1 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 BUFFER, INVERTING CTFT CASE OUTLINE SOURCE AND DESIGNATOR MO-001AC JOINT ELECTRON DEVICE ENGINEERING COUNCIL TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HIGH CURRENT AND HIGH VOLTAGE AND HERMETICALLY SEALED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 BUFFER, INVERTING |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | MO-001AC JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |