NSN 5962-01-143-1733 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011431733 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011431733 |
| NCB Code: USA (01) |
| Manufacturers: General Regulator Corp , National Semiconductor Corp , Intel Corp Sales Office |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers PSEN-A202GR, MM-2147J-3 883B, MD-2147H-3 B under NSN 5962-01-143-1733 of Microcircuit Memory manufactured by General Regulator Corp, National Semiconductor Corp, Intel Corp Sales Office.
Federal Supply Class of NSN 5962-01-143-1733 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-143-1733, 5962011431733
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Part No Manufacturer Item Name QTY RFQ PSEN-A202GR General Regulator Corp microcircuit memory Avl RFQ MM-2147J-3 883B National Semiconductor Corp microcircuit memory Avl RFQ MD-2147H-3 B Intel Corp Sales Office microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011431733MRC Criteria Characteristic CZEQ Time Rating Per Chacteristic 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS CZER Memory Device Type ROM CQZP Input Circuit Pattern 15 INPUT ADAT Body Width 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM CQSJ Inclosure Material CERAMIC CWSG Terminal Surface Treatment SOLDER MRC Decoded Requirement Clear Text Reply ADAQ Body Length 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM CBBL Features Provided STATIC OPERATION AND HIGH SPEED AND HERMETICALLY SEALED AEHX Maximum Power Dissipation Rating 1.2 WATTS ADAU Body Height 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). AFGA Operating Temp Range -10.0/+85.0 DEG CELSIUS TTQY Terminal Type And Quantity 18 PRINTED CIRCUIT CQSZ Inclosure Configuration DUAL-IN-LINE CQWX Output Logic Form METAL OXIDE-SEMICONDUCTOR LOGIC CZEN Voltage Rating And Type Per Characteristic 7.0 VOLTS MAXIMUM POWER SOURCE
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CZER | Memory Device Type | ROM |
| CQZP | Input Circuit Pattern | 15 INPUT |
| ADAT | Body Width | 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC |
| CWSG | Terminal Surface Treatment | SOLDER |
| MRC | Decoded Requirement | Clear Text Reply |
| ADAQ | Body Length | 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM |
| CBBL | Features Provided | STATIC OPERATION AND HIGH SPEED AND HERMETICALLY SEALED |
| AEHX | Maximum Power Dissipation Rating | 1.2 WATTS |
| ADAU | Body Height | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFGA | Operating Temp Range | -10.0/+85.0 DEG CELSIUS |
| TTQY | Terminal Type And Quantity | 18 PRINTED CIRCUIT |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CQWX | Output Logic Form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |