NSN 5962-01-147-3047 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011473047 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011473047 |
| NCB Code: USA (01) |
| Manufacturers: Cypress Semiconductor Corporation , Advanced Micro Devices Inc , Raytheon Aircraft , Fairchild Semiconductor Corp , Tektronix Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers CY3341DMB, AM3341DMB, AM3341DC, AM3341 BEA, 899369-1 under NSN 5962-01-147-3047 of Microcircuit Memory manufactured by Cypress Semiconductor Corporation, Advanced Micro Devices Inc, Raytheon Aircraft, Fairchild Semiconductor Corp, Tektronix Inc.
Federal Supply Class of NSN 5962-01-147-3047 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-147-3047, 5962011473047
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Part No Manufacturer Item Name QTY RFQ CY3341DMB Cypress Semiconductor Corporation microcircuit memory Avl RFQ AM3341DMB Advanced Micro Devices Inc microcircuit memory Avl RFQ AM3341DC Advanced Micro Devices Inc microcircuit memory Avl RFQ AM3341 BEA Advanced Micro Devices Inc microcircuit memory Avl RFQ 899369-1 Raytheon Aircraft microcircuit memory Avl RFQ 3341DLQB Fairchild Semiconductor Corp microcircuit memory Avl RFQ 3341ADMQB Fairchild Semiconductor Corp microcircuit memory Avl RFQ 3341ADM Fairchild Semiconductor Corp microcircuit memory Avl RFQ 156-1346-00 Tektronix Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011473047MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM ADAT BODY WIDTH 0.275 INCHES MINIMUM AND 0.290 INCHES MAXIMUM ADAU BODY HEIGHT 0.199 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 450.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION AN/WLR-6 33472 CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND ASYNCHRONOUS AND EXPANDABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE FIRST-IN FIRST-OUT CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.275 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.199 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | AN/WLR-6 33472 |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND ASYNCHRONOUS AND EXPANDABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |