NSN 5962-01-171-5582 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011715582 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011715582 |
| NCB Code: USA (01) |
| Manufacturers: Fairchild Semiconductor Corp , Dla Land And Maritime , Intersil Corporation , Advanced Micro Devices Inc , Philips Semiconductors Inc , Raytheon Aircraft , Mmi Amd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers RY4023, ROM PROM FAMILY 078, N0078-104, HM-7685, DH76052-4 under NSN 5962-01-171-5582 of Microcircuit Memory manufactured by Fairchild Semiconductor Corp, Dla Land And Maritime, Intersil Corporation, Advanced Micro Devices Inc, Philips Semiconductors Inc.
Federal Supply Class of NSN 5962-01-171-5582 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-171-5582, 5962011715582
-
Part No Manufacturer Item Name QTY RFQ RY4023 Fairchild Semiconductor Corp microcircuit memory Avl RFQ ROM PROM FAMILY 078 Dla Land And Maritime microcircuit memory Avl RFQ N0078-104 Intersil Corporation microcircuit memory Avl RFQ HM-7685 Intersil Corporation microcircuit memory Avl RFQ DH76052-4 Advanced Micro Devices Inc microcircuit memory Avl RFQ CC6323-104 Philips Semiconductors Inc microcircuit memory Avl RFQ 932905-104 Raytheon Aircraft microcircuit memory Avl RFQ 932892-1B Raytheon Aircraft microcircuit memory Avl RFQ 19583 Mmi Amd microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011715582MRC Criteria Characteristic ADAQ BODY LENGTH 0.520 INCHES MAXIMUM ADAT BODY WIDTH 0.390 INCHES MAXIMUM ADAU BODY HEIGHT 0.085 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 715.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 12 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 82577-932892 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 18 FLAT LEADS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.520 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.390 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 715.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 82577-932892 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |