NSN 5962-01-179-7055 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011797055 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011797055 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Mmi Amd , Aai Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 022, MM6330-1J, 58812-40042-1, 58812-40042 under NSN 5962-01-179-7055 of Microcircuit Memory manufactured by Dla Land And Maritime, Mmi Amd, Aai Corporation.
Federal Supply Class of NSN 5962-01-179-7055 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-179-7055, 5962011797055
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 022 Dla Land And Maritime microcircuit memory Avl RFQ MM6330-1J Mmi Amd microcircuit memory Avl RFQ 58812-40042-1 Aai Corporation microcircuit memory Avl RFQ 58812-40042 Aai Corporation microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011797055MRC Criteria Characteristic ADAQ BODY LENGTH 0.790 INCHES MAXIMUM ADAT BODY WIDTH 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.175 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 307.2 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS NOMINAL POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.790 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.175 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 307.2 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS NOMINAL POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |