NSN 5962-01-189-7756 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011897756 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011897756 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Dla Land And Maritime , Sci Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TMS2532TL, TMS2532JL, DMS 86003B, 2532JM B, 015220 2532XBER under NSN 5962-01-189-7756 of Microcircuit Memory manufactured by Texas Instrument Inc, Dla Land And Maritime, Sci Systems Inc.
Federal Supply Class of NSN 5962-01-189-7756 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-189-7756, 5962011897756
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Part No Manufacturer Item Name QTY RFQ TMS2532TL Texas Instrument Inc microcircuit memory Avl RFQ TMS2532JL Texas Instrument Inc microcircuit memory Avl RFQ DMS 86003B Dla Land And Maritime microcircuit memory Avl RFQ 2532JM B Texas Instrument Inc microcircuit memory Avl RFQ 015220 2532XBER Sci Systems Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011897756MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.600 INCHES MAXIMUM ADAU BODY HEIGHT 0.205 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -55.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND ERASABLE AND HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL CERAMIC OR METAL CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 13 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 6.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 17981-015220/2532 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.205 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND ERASABLE AND HERMETICALLY SEALED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC OR METAL |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 17981-015220/2532 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |