NSN 5962-01-190-8278 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011908278 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011908278 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Stmicroelectronics Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ2516-45JR, SMJ2516-45JM, MM2716QE883B, MKB2716J78 under NSN 5962-01-190-8278 of Microcircuit Memory manufactured by Texas Instrument Inc, National Semiconductor Corp, Stmicroelectronics Inc.
Federal Supply Class of NSN 5962-01-190-8278 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-190-8278, 5962011908278
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Part No Manufacturer Item Name QTY RFQ SMJ2516-45JR Texas Instrument Inc microcircuit memory Avl RFQ SMJ2516-45JM Texas Instrument Inc microcircuit memory Avl RFQ MM2716QE883B National Semiconductor Corp microcircuit memory Avl RFQ MKB2716J78 Stmicroelectronics Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011908278MRC Criteria Characteristic ADAQ BODY LENGTH 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.155 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS CBBL FEATURES PROVIDED ERASABLE AND PROGRAMMABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.155 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ERASABLE AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |