NSN 5962-01-216-0728 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012160728 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012160728 |
NCB Code: USA (01) |
Manufacturers: Now Electronics Inc , Drs Icas Llc , Fairchild Semiconductor Corp , Advanced Micro Devices Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SC5962-0555-2, DH76248, AM27LS00 BEA under NSN 5962-01-216-0728 of Microcircuit Memory manufactured by Now Electronics Inc, Drs Icas Llc, Fairchild Semiconductor Corp, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-01-216-0728 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-216-0728, 5962012160728
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Part No Manufacturer Item Name QTY RFQ SC5962-0555-2 Now Electronics Inc microcircuit memory Avl RFQ SC5962-0555-2 Drs Icas Llc microcircuit memory Avl RFQ SC5962-0555-2 Fairchild Semiconductor Corp microcircuit memory Avl RFQ DH76248 Advanced Micro Devices Inc microcircuit memory Avl RFQ AM27LS00 BEA Advanced Micro Devices Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012160728MRC Criteria Characteristic ADAQ BODY LENGTH 0.765 INCHES NOMINAL ADAT BODY WIDTH 0.275 INCHES NOMINAL ADAU BODY HEIGHT 0.165 INCHES NOMINAL AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND BURN IN CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 13 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.765 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.275 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.165 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND BURN IN |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |