NSN 5962-01-264-3001 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012643001 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012643001 |
| NCB Code: USA (01) |
| Manufacturers: Raytheon Aircraft , Dla Land And Maritime , Freescale Semiconductor Inc , Stmicroelectronics Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers G282789-8561, 8202103XX, 8202103XA, 82021, 68000-10T BUCJC under NSN 5962-01-264-3001 of Microcircuit Digital manufactured by Raytheon Aircraft, Dla Land And Maritime, Freescale Semiconductor Inc, Stmicroelectronics Inc.
Federal Supply Class of NSN 5962-01-264-3001 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-264-3001, 5962012643001
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Part No Manufacturer Item Name QTY RFQ G282789-8561 Raytheon Aircraft microcircuit digital Avl RFQ 8202103XX Dla Land And Maritime microcircuit digital Avl RFQ 8202103XA Dla Land And Maritime microcircuit digital Avl RFQ 82021 Dla Land And Maritime microcircuit digital Avl RFQ 68000-10T BUCJC Freescale Semiconductor Inc microcircuit digital Avl RFQ 5962-8202103BXX Dla Land And Maritime microcircuit digital Avl RFQ 5962-8202103BXB Dla Land And Maritime microcircuit digital Avl RFQ 5962-8202103BXB Stmicroelectronics Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012643001MRC Criteria Characteristic ADAQ BODY LENGTH 0.962 INCHES MAXIMUM ADAT BODY WIDTH 0.962 INCHES MAXIMUM ADAU BODY HEIGHT 0.120 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.75 WATTS AFGA OPERATING TEMP RANGE -55.0/+110.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND FIXED AND W/ENABLE AND W/RESET CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 27 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 MICROPROCESSOR CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-7 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 68 LEADLESS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.962 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.962 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.75 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+110.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND FIXED AND W/ENABLE AND W/RESET |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 27 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-7 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 68 LEADLESS |