NSN 5962-01-264-3003 of Microcircuit Digital - Parts Details
Alternative NSN: 5962012643003 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012643003 |
NCB Code: USA (01) |
Manufacturers: General Motors Corp , Thales Components Corporation , Dla Land And Maritime , Philips Semiconductors Inc , Freescale Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TS6800VEB B10, TS68000MEB C10, 8202103ZX, 8202103ZB, 8202103ZA under NSN 5962-01-264-3003 of Microcircuit Digital manufactured by General Motors Corp, Thales Components Corporation, Dla Land And Maritime, Philips Semiconductors Inc, Freescale Semiconductor Inc.
Federal Supply Class of NSN 5962-01-264-3003 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-264-3003, 5962012643003
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Part No Manufacturer Item Name QTY RFQ TS6800VEB B10 General Motors Corp microcircuit digital Avl RFQ TS68000MEB C10 Thales Components Corporation microcircuit digital Avl RFQ 8202103ZX Dla Land And Maritime microcircuit digital Avl RFQ 8202103ZB Dla Land And Maritime microcircuit digital Avl RFQ 8202103ZA Dla Land And Maritime microcircuit digital Avl RFQ 82021 Dla Land And Maritime microcircuit digital Avl RFQ 68000-10BUC Philips Semiconductors Inc microcircuit digital Avl RFQ 68000-10 BUCJC Freescale Semiconductor Inc microcircuit digital Avl RFQ 5962-8202103BZX Dla Land And Maritime microcircuit digital Avl RFQ 5962-8202103BZB Dla Land And Maritime microcircuit digital Avl RFQ 5962-8202103BZA Dla Land And Maritime microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012643003MRC Criteria Characteristic ADAQ BODY LENGTH 0.962 INCHES MAXIMUM ADAT BODY WIDTH 0.962 INCHES MAXIMUM ADAU BODY HEIGHT 0.120 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.75 WATTS AFGA OPERATING TEMP RANGE -55.0/+110.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND FIXED AND W/ENABLE AND W/RESET CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 27 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 MICROPROCESSOR CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-7 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 68 LEADLESS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.962 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.962 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.75 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+110.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND FIXED AND W/ENABLE AND W/RESET |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 27 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-7 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 68 LEADLESS |