NSN 5962-01-266-8054 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012668054 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012668054 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Advanced Micro Devices Inc , Thales Avionics , Aai Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 071, AM27256-35 BXA, 91588455, 58082-7, 58082-42031 under NSN 5962-01-266-8054 of Microcircuit Memory manufactured by Dla Land And Maritime, Advanced Micro Devices Inc, Thales Avionics, Aai Corporation.
Federal Supply Class of NSN 5962-01-266-8054 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-266-8054, 5962012668054
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 071 Dla Land And Maritime microcircuit memory Avl RFQ AM27256-35 BXA Advanced Micro Devices Inc microcircuit memory Avl RFQ 91588455 Thales Avionics microcircuit memory Avl RFQ 58082-7 Aai Corporation microcircuit memory Avl RFQ 58082-42031 Aai Corporation microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012668054MRC Criteria Characteristic ADAQ BODY LENGTH 1.440 INCHES MINIMUM AND 1.500 INCHES MAXIMUM ADAT BODY WIDTH 0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM ADAU BODY HEIGHT 0.145 INCHES MINIMUM AND 0.165 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 525.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0 TO 70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 125.0 DEG CELSIUS CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND PROGRAMMABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 17 INPUT CRHL BIT QUANTITY 262144 CSWJ WORD QUANTITY 32768 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 13.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.440 INCHES MINIMUM AND 1.500 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 525.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CRHL | BIT QUANTITY | 262144 |
| CSWJ | WORD QUANTITY | 32768 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 13.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |