NSN 5962-01-274-5254 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012745254 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012745254 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Dla Land And Maritime , Hamilton Sundstrand Corporation , Rochester Electronics Llc , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ32010FDS, 8405301ZA, 791525-1, 32010FDS B, 10136443 under NSN 5962-01-274-5254 of Microcircuit Digital manufactured by Texas Instrument Inc, Dla Land And Maritime, Hamilton Sundstrand Corporation, Rochester Electronics Llc, Paeaeesikunta Logistiikkaosasto.
Federal Supply Class of NSN 5962-01-274-5254 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-274-5254, 5962012745254
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Part No Manufacturer Item Name QTY RFQ SMJ32010FDS Texas Instrument Inc microcircuit digital Avl RFQ 8405301ZA Dla Land And Maritime microcircuit digital Avl RFQ 791525-1 Hamilton Sundstrand Corporation microcircuit digital Avl RFQ 32010FDS B Rochester Electronics Llc microcircuit digital Avl RFQ 10136443 Paeaeesikunta Logistiikkaosasto microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012745254MRC Criteria Characteristic ADAQ BODY LENGTH 0.662 INCHES MAXIMUM ADAT BODY WIDTH 0.662 INCHES MAXIMUM ADAU BODY HEIGHT 0.120 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.5 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND W/ENABLE AND BIDIRECTIONAL CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 22 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 PROCESSOR, INPUT/OUTPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 44 LEADLESS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.662 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.662 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND W/ENABLE AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 PROCESSOR, INPUT/OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 44 LEADLESS |