NSN 5962-01-277-8709 of Microcircuit Linear - Parts Details
Alternative NSN: 5962012778709 |
Item Name: Microcircuit Linear |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012778709 |
NCB Code: USA (01) |
Manufacturers: University Of Texas At Austin , Texas Instrument Inc , National Semiconductor Corp , Ge Aviation Systems Llc , Thales Communications Inc , Dla Land And Maritime , Boeing Company , Hamilton Sundstrand Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ED1362-001, ED1362, DS9638MJ, DS9638J 883, 9638DM under NSN 5962-01-277-8709 of Microcircuit Linear manufactured by University Of Texas At Austin, Texas Instrument Inc, National Semiconductor Corp, Ge Aviation Systems Llc, Thales Communications Inc.
Federal Supply Class of NSN 5962-01-277-8709 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-277-8709, 5962012778709
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Part No Manufacturer Item Name QTY RFQ ED1362-001 University Of Texas At Austin microcircuit linear Avl RFQ ED1362 Texas Instrument Inc microcircuit linear Avl RFQ ED1362 University Of Texas At Austin microcircuit linear Avl RFQ DS9638MJ National Semiconductor Corp microcircuit linear Avl RFQ DS9638J 883 National Semiconductor Corp microcircuit linear Avl RFQ 9638DM Ge Aviation Systems Llc microcircuit linear Avl RFQ 938915 Thales Communications Inc microcircuit linear Avl RFQ 5962-8754601PX Dla Land And Maritime microcircuit linear Avl RFQ 5962-8754601PB Dla Land And Maritime microcircuit linear Avl RFQ 5962-8754601PA Dla Land And Maritime microcircuit linear Avl RFQ 5962-87546 Dla Land And Maritime microcircuit linear Avl RFQ 477-2179-001 Boeing Company microcircuit linear Avl RFQ 23-00365-1 Hamilton Sundstrand Corporation microcircuit linear Avl RFQ
Characteristics Data of NSN 5962012778709MRC Criteria Characteristic ADAQ BODY LENGTH 0.405 INCHES MAXIMUM ADAT BODY WIDTH 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 400.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+175.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HIGH SPEED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN DUAL 1 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 DRIVER, LINE DIFFERENTIAL CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-4 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 8 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.405 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 400.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+175.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HIGH SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | DUAL 1 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 DRIVER, LINE DIFFERENTIAL |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-4 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 8 PRINTED CIRCUIT |