NSN 5962-01-289-7661 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012897661 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012897661 |
| NCB Code: USA (01) |
| Manufacturers: S T C Telecommunications Ltd , Intersil Corporation , Rockwell Collins Inc , Cassidian Limited |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers PT5562-SG-904094, HM1-6642-8 883, HM1-6642-8, HM1-6642 883, HM1-6641-8 under NSN 5962-01-289-7661 of Microcircuit Memory manufactured by S T C Telecommunications Ltd, Intersil Corporation, Rockwell Collins Inc, Cassidian Limited.
Federal Supply Class of NSN 5962-01-289-7661 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-289-7661, 5962012897661
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Part No Manufacturer Item Name QTY RFQ PT5562-SG-904094 S T C Telecommunications Ltd microcircuit memory Avl RFQ HM1-6642-8 883 Intersil Corporation microcircuit memory Avl RFQ HM1-6642-8 Intersil Corporation microcircuit memory Avl RFQ HM1-6642 883 Intersil Corporation microcircuit memory Avl RFQ HM1-6641-8 Intersil Corporation microcircuit memory Avl RFQ 351-5690-020 Rockwell Collins Inc microcircuit memory Avl RFQ 258-0008-010 Rockwell Collins Inc microcircuit memory Avl RFQ 19C-ST03002AAA Cassidian Limited microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012897661MRC Criteria Characteristic ADAQ BODY LENGTH 1.240 INCHES MINIMUM AND 1.270 INCHES MAXIMUM ADAT BODY WIDTH 0.515 INCHES MINIMUM AND 0.535 INCHES MAXIMUM ADAU BODY HEIGHT 0.130 INCHES MINIMUM AND 0.135 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND W/ENABLE AND HIGH SPEED AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 13 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.240 INCHES MINIMUM AND 1.270 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.535 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.135 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND W/ENABLE AND HIGH SPEED AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |