NSN 5962-01-299-2135 of Microcircuit Digital - Parts Details
Alternative NSN: 5962012992135 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012992135 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Miltope Corp , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ5412W, SNI5412W, SN5412, M50-122, 619632-902 under NSN 5962-01-299-2135 of Microcircuit Digital manufactured by Texas Instrument Inc, Miltope Corp, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-299-2135 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-299-2135, 5962012992135
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Part No Manufacturer Item Name QTY RFQ SNJ5412W Texas Instrument Inc microcircuit digital Avl RFQ SNI5412W Texas Instrument Inc microcircuit digital Avl RFQ SN5412 Texas Instrument Inc microcircuit digital Avl RFQ M50-122 Miltope Corp microcircuit digital Avl RFQ 619632-902 Raytheon Aircraft microcircuit digital Avl RFQ 61932-902 Raytheon Aircraft microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012992135MRC Criteria Characteristic ADAQ BODY LENGTH 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM ADAU BODY HEIGHT 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 10.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND W/OPEN COLLECTOR AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN TRIPLE 3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 3 GATE, NAND CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 10.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/OPEN COLLECTOR AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 3 GATE, NAND |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |