NSN 5962-01-304-4400 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013044400 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013044400 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Integrated Device Technology Inc , Drs Sustainment Systems Inc Division , White Electronic Designs Corporation , Global Associates Ltd Signal Processing Systems |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ68CE256-55M, IDT71256S85DB, ES5447-02, EDH8832C-70KMHR, 28105283 under NSN 5962-01-304-4400 of Microcircuit Memory manufactured by Texas Instrument Inc, Integrated Device Technology Inc, Drs Sustainment Systems Inc Division, White Electronic Designs Corporation, Global Associates Ltd Signal Processing Systems.
Federal Supply Class of NSN 5962-01-304-4400 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-304-4400, 5962013044400
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Part No Manufacturer Item Name QTY RFQ SMJ68CE256-55M Texas Instrument Inc microcircuit memory Avl RFQ IDT71256S85DB Integrated Device Technology Inc microcircuit memory Avl RFQ ES5447-02 Drs Sustainment Systems Inc Division microcircuitmemory Avl RFQ EDH8832C-70KMHR White Electronic Designs Corporation microcircuit memory Avl RFQ 28105283 Global Associates Ltd Signal Processing Systems microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013044400MRC Criteria Characteristic ADAQ BODY LENGTH 1.400 INCHES NOMINAL ADAT BODY WIDTH 0.594 INCHES MAXIMUM ADAU BODY HEIGHT 0.280 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 26 INPUT CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT CWSG TERMINAL SURFACE TREATMENT SOLDER
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.400 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.594 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.280 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |