NSN 5962-01-306-8890 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013068890 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013068890 |
| NCB Code: USA (01) |
| Manufacturers: Selex Galileo Ltd , Intersil Corporation , Texas Instrument Inc , Harris Corporation , Elpaz Instruments Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers VA-85-0727-103, CD74HCT03E, CD54HCT03F 3A, CD54HCT03F, 90132-1 under NSN 5962-01-306-8890 of Microcircuit Digital manufactured by Selex Galileo Ltd, Intersil Corporation, Texas Instrument Inc, Harris Corporation, Elpaz Instruments Inc.
Federal Supply Class of NSN 5962-01-306-8890 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-306-8890, 5962013068890
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Part No Manufacturer Item Name QTY RFQ VA-85-0727-103 Selex Galileo Ltd microcircuit digital Avl RFQ CD74HCT03E Intersil Corporation microcircuit digital Avl RFQ CD74HCT03E Texas Instrument Inc microcircuit digital Avl RFQ CD54HCT03F 3A Intersil Corporation microcircuit digital Avl RFQ CD54HCT03F 3A Harris Corporation microcircuit digital Avl RFQ CD54HCT03F Intersil Corporation microcircuit digital Avl RFQ 90132-1 Elpaz Instruments Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013068890MRC Criteria Characteristic ABKW OVERALL HEIGHT 0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM ADAQ BODY LENGTH 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-1 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT CQSJ INCLOSURE MATERIAL CERAMIC AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |