NSN 5962-01-364-8001 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013648001 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013648001 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ44C256-15JDM, 5962-9061701MRA under NSN 5962-01-364-8001 of Microcircuit Memory manufactured by Texas Instrument Inc, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-364-8001 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-364-8001, 5962013648001
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Part No Manufacturer Item Name QTY RFQ SMJ44C256-15JDM Texas Instrument Inc microcircuit memory Avl RFQ 5962-9061701MRA Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013648001MRC Criteria Characteristic AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION VSDS MH60G GR E/I FSCM 7S976 CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM HI-PERFORMANCE MOS CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -5.0 VOLTS MINIMUM APPLIED AND 5.0 VOLTS MAXIMUM APPLIED CZER MEMORY DEVICE TYPE RAM TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT ZZZK SPECIFICATION/STANDARD DATA 96906-MIL-STD-883 GOVERNMENT STANDARD CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-8 MIL-M-38510 CQSJ INCLOSURE MATERIAL CERAMIC CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MINIMUM ACCESS AND 150.00 NANOSECONDS MAXIMUM ACCESS CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY 262,144-WORD BY 4-BIT DYNAMIC RANDOM-ACCESS MEMORY
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | VSDS MH60G GR E/I FSCM 7S976 |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | HI-PERFORMANCE MOS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -5.0 VOLTS MINIMUM APPLIED AND 5.0 VOLTS MAXIMUM APPLIED |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| ZZZK | SPECIFICATION/STANDARD DATA | 96906-MIL-STD-883 GOVERNMENT STANDARD |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MINIMUM ACCESS AND 150.00 NANOSECONDS MAXIMUM ACCESS |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | 262,144-WORD BY 4-BIT DYNAMIC RANDOM-ACCESS MEMORY |