NSN 5962-01-371-9047 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013719047 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013719047 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Advanced Micro Devices Inc , Philips Semiconductors Inc , Raytheon Aircraft , Freescale Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN54LS174W, SD74638, DH12694, CC2226, 615282-902 under NSN 5962-01-371-9047 of Microcircuit Digital manufactured by Texas Instrument Inc, National Semiconductor Corp, Advanced Micro Devices Inc, Philips Semiconductors Inc, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-371-9047 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-371-9047, 5962013719047
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Part No Manufacturer Item Name QTY RFQ SN54LS174W Texas Instrument Inc microcircuit digital Avl RFQ SD74638 National Semiconductor Corp microcircuit digital Avl RFQ DH12694 Advanced Micro Devices Inc microcircuit digital Avl RFQ CC2226 Philips Semiconductors Inc microcircuit digital Avl RFQ 615282-902 Raytheon Aircraft microcircuit digital Avl RFQ 583R343H01 Texas Instrument Inc microcircuit digital Avl RFQ 583R343H01 Freescale Semiconductor Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013719047MRC Criteria Characteristic ADAQ BODY LENGTH 0.440 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM ADAU BODY HEIGHT 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 150.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND SCHOTTKY AND HIGH CURRENT AND W/ENABLE AND W/CLEAR CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 8 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 FLIP-FLOP, CLOCKED AND 6 FLIP-FLOP, D-TYPE CTFT CASE OUTLINE SOURCE AND DESIGNATOR F-5 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER TTQY TERMINAL TYPE AND QUANTITY 16 FLAT LEADS CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 150.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND SCHOTTKY AND HIGH CURRENT AND W/ENABLE AND W/CLEAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 FLIP-FLOP, CLOCKED AND 6 FLIP-FLOP, D-TYPE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |