NSN 5962-01-372-3605 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013723605 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013723605 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Rca Corp , British Sarozal Ltd , Intersil Corporation , Ramtek Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN74HCT374J N, CD74HCT374E, 1310483-01, 1310413-01 under NSN 5962-01-372-3605 of Microcircuit Digital manufactured by Texas Instrument Inc, Rca Corp, British Sarozal Ltd, Intersil Corporation, Ramtek Corp.
Federal Supply Class of NSN 5962-01-372-3605 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-372-3605, 5962013723605
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Part No Manufacturer Item Name QTY RFQ SN74HCT374J N Texas Instrument Inc microcircuit digital Avl RFQ CD74HCT374E Rca Corp microcircuit digital Avl RFQ CD74HCT374E British Sarozal Ltd microcircuit digital Avl RFQ CD74HCT374E Intersil Corporation microcircuit digital Avl RFQ 1310483-01 Ramtek Corp microcircuit digital Avl RFQ 1310413-01 Ramtek Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013723605MRC Criteria Characteristic AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND POSITIVE EDGE TRIGGERED AND 3-STATE OUTPUT CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN OCTAL 1 INPUT CSSL DESIGN FUNCTION AND QUANTITY 8 FLIP-FLOP, D-TYPE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL CERAMIC
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND POSITIVE EDGE TRIGGERED AND 3-STATE OUTPUT |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | OCTAL 1 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 FLIP-FLOP, D-TYPE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |