NSN 5962-01-386-7246 of Microcircuit Digital - Parts Details
Alternative NSN: 5962013867246 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013867246 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Kearfott Corp , Lsi Logic Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers NHA584C149-101, A584C149-101, A584A465-101 under NSN 5962-01-386-7246 of Microcircuit Digital manufactured by Dla Land And Maritime, Kearfott Corp, Lsi Logic Corp.
Federal Supply Class of NSN 5962-01-386-7246 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-386-7246, 5962013867246
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Part No Manufacturer Item Name QTY RFQ NHA584C149-101 Dla Land And Maritime microcircuit digital Avl RFQ A584C149-101 Kearfott Corp microcircuit digital Avl RFQ A584A465-101 Kearfott Corp microcircuit digital Avl RFQ A584A465-101 Lsi Logic Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013867246MRC Criteria Characteristic ADAQ BODY LENGTH 0.758 INCHES MAXIMUM" ADAT BODY WIDTH 0.758 INCHES MAXIMUM" ADAU BODY HEIGHT 0.145 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND BURN IN AND BIDIRECTIONAL" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER" CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC" CSSL DESIGN FUNCTION AND QUANTITY 1 CONTROL, INTERFACE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" NHCF NUCLEAR HARDNESS CRITICAL FEATURE HARDENED" TTQY TERMINAL TYPE AND QUANTITY 100 FLAT LEADS" ADAQ BODY LENGTH 0.758 INCHES MAXIMUM" ADAT BODY WIDTH 0.758 INCHES MAXIMUM" ADAU BODY HEIGHT 0.145 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND BURN IN AND BIDIRECTIONAL" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER" CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC" CSSL DESIGN FUNCTION AND QUANTITY 1 CONTROL, INTERFACE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" NHCF NUCLEAR HARDNESS CRITICAL FEATURE HARDENED" TTQY TERMINAL TYPE AND QUANTITY 100 FLAT LEADS"
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.758 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.758 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.145 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND BURN IN AND BIDIRECTIONAL" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 CONTROL, INTERFACE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED" |
TTQY | TERMINAL TYPE AND QUANTITY | 100 FLAT LEADS" |
ADAQ | BODY LENGTH | 0.758 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.758 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.145 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND BURN IN AND BIDIRECTIONAL" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 CONTROL, INTERFACE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED" |
TTQY | TERMINAL TYPE AND QUANTITY | 100 FLAT LEADS" |