NSN 5962-01-554-3770 of Microcircuit Memory - Parts Details
Alternative NSN: 5962015543770 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 015543770 |
NCB Code: USA (01) |
Manufacturers: Xilinx Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers XCV1000E 6HQ240C under NSN 5962-01-554-3770 of Microcircuit Memory manufactured by Xilinx Inc.
Federal Supply Class of NSN 5962-01-554-3770 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-554-3770, 5962015543770
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Part No Manufacturer Item Name QTY RFQ XCV1000E 6HQ240C Xilinx Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962015543770MRC Criteria Characteristic CTQX Current Rating Per Characteristic 500.00 MILLIAMPERES FORWARD CURRENT, NONREPETITIVE, MAXIMUM PEAK TOTAL VALUE ABSOLUTE CZEN Voltage Rating And Type Per Characteristic 1.8 VOLTS NOMINAL TOTAL SUPPLY CZEQ Time Rating Per Chacteristic 6.00 NANOSECONDS NOMINAL DELAY CZER Memory Device Type RAM CQSJ Inclosure Material PLASTIC MRC Decoded Requirement Clear Text Reply CXCY Part Name Assigned By Controlling Agency FIELD PROGRAMMABLE GATE ARRAY AFGA Operating Temp Range +0.0/+85.0 DEG CELSIUS CQSZ Inclosure Configuration FLAT PACK CBBL Features Provided LOW POWER AND W/CLOCK AND 3-STATE OUTPUT TTQY Terminal Type And Quantity 240 FLAT LEADS CQWX Output Logic Form COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CZZZ Memory Capacity 64 X 96
MRC | Criteria | Characteristic |
---|---|---|
CTQX | Current Rating Per Characteristic | 500.00 MILLIAMPERES FORWARD CURRENT, NONREPETITIVE, MAXIMUM PEAK TOTAL VALUE ABSOLUTE |
CZEN | Voltage Rating And Type Per Characteristic | 1.8 VOLTS NOMINAL TOTAL SUPPLY |
CZEQ | Time Rating Per Chacteristic | 6.00 NANOSECONDS NOMINAL DELAY |
CZER | Memory Device Type | RAM |
CQSJ | Inclosure Material | PLASTIC |
MRC | Decoded Requirement | Clear Text Reply |
CXCY | Part Name Assigned By Controlling Agency | FIELD PROGRAMMABLE GATE ARRAY |
AFGA | Operating Temp Range | +0.0/+85.0 DEG CELSIUS |
CQSZ | Inclosure Configuration | FLAT PACK |
CBBL | Features Provided | LOW POWER AND W/CLOCK AND 3-STATE OUTPUT |
TTQY | Terminal Type And Quantity | 240 FLAT LEADS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZZZ | Memory Capacity | 64 X 96 |