NSN 5962-01-576-5546 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962015765546 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 015765546 |
| NCB Code: USA (01) |
| Manufacturers: Hittite Microwave Corporation , Thales Avionics , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers HMC241QS16, 91793093, 10354558 under NSN 5962-01-576-5546 of Microcircuit Linear manufactured by Hittite Microwave Corporation, Thales Avionics, Paeaeesikunta Logistiikkaosasto.
Federal Supply Class of NSN 5962-01-576-5546 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-576-5546, 5962015765546
Characteristics Data of NSN 5962015765546MRC Criteria Characteristic CXCY Part Name Assigned By Controlling Agency GAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ FEAT Special Features PACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C; NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND MRC Decoded Requirement Clear Text Reply
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | Part Name Assigned By Controlling Agency | GAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ |
| FEAT | Special Features | PACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C; NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND |
| MRC | Decoded Requirement | Clear Text Reply |