NSN 5999-01-578-9923 of Core Shielding Bead - Parts Details
| Alternative NSN: 5999015789923 |
| Item Name: Core Shielding Bead |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5999 Miscellaneous Electrical and Electronic Components |
| NIIN: 015789923 |
| NCB Code: USA (01) |
| Manufacturers: Tdk Lambda Americas Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MMZ2012S601A under NSN 5999-01-578-9923 of Core Shielding Bead manufactured by Tdk Lambda Americas Inc.
Federal Supply Class of NSN 5999-01-578-9923 is FSC 5999 contains part details of Miscellaneous Electrical and Electronic Components. Quote for your desired part numbers.
Part Number's List for NSN 5999-01-578-9923, 5999015789923
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Part No Manufacturer Item Name QTY RFQ MMZ2012S601A Tdk Lambda Americas Inc core shielding bead Avl RFQ
Characteristics Data of NSN 5999015789923MRC Criteria Characteristic FEAT Special Features CHIP BEAD (IMPEDER), MMZ SERIES OFFERS 4 CONSTRUCTION MATERIALS; SIZE STANDARIZED FOR USE BY AUTOMATIC ASSEMBLY EQUIPMENT; NO PREFERRED ORIENTATION; EITHER FLOW OR REFLOW SOLDERING METHODS CAN BE USED DUE TO ELECTROPLATING OF THE TERMINAL ELECTRODES; HIGH RELIABILITY DUE TO AN ENTIRELY MONOLITHIC STRUCTURE; CLOSED MAGNETIC CIRCUIT STRUCTURE ALLOWS HIGH-DENSITY INSTALLATION WHILE PREVENTING CROSSTALK BETWEEN CIRCUITS; LOW DC RESISTANCE STRUCTURE OF ELECTRODE PREVENTS WASTEFUL ELECTRIC POWER CONSUMPTION; CONTAINS NO LEAD AND ALSO SUPPORT LEAD-FREE SOLDERING; CONFORMING TO ROHS DIRECTIVE CXCY Part Name Assigned By Controlling Agency CHIP BEADS(SMD) FOR SIGNAL LINE MRC Decoded Requirement Clear Text Reply
| MRC | Criteria | Characteristic |
|---|---|---|
| FEAT | Special Features | CHIP BEAD (IMPEDER), MMZ SERIES OFFERS 4 CONSTRUCTION MATERIALS; SIZE STANDARIZED FOR USE BY AUTOMATIC ASSEMBLY EQUIPMENT; NO PREFERRED ORIENTATION; EITHER FLOW OR REFLOW SOLDERING METHODS CAN BE USED DUE TO ELECTROPLATING OF THE TERMINAL ELECTRODES; HIGH RELIABILITY DUE TO AN ENTIRELY MONOLITHIC STRUCTURE; CLOSED MAGNETIC CIRCUIT STRUCTURE ALLOWS HIGH-DENSITY INSTALLATION WHILE PREVENTING CROSSTALK BETWEEN CIRCUITS; LOW DC RESISTANCE STRUCTURE OF ELECTRODE PREVENTS WASTEFUL ELECTRIC POWER CONSUMPTION; CONTAINS NO LEAD AND ALSO SUPPORT LEAD-FREE SOLDERING; CONFORMING TO ROHS DIRECTIVE |
| CXCY | Part Name Assigned By Controlling Agency | CHIP BEADS(SMD) FOR SIGNAL LINE |
| MRC | Decoded Requirement | Clear Text Reply |