ASAP Aviation Procurement is pleased to announce that part number MMI6301-J of NSN 5962-01-373-9120 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number MMI6301-J is a Microcircuit Memory manufactured by Advanced Micro Devices Inc under CAGE Code 34335. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote. In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. MMI6301-J Advanced Micro Devices Inc is in stock.
Are you interested in learning more about part number MMI6301-J? If so, feel free to contact us by phone at +1-714-705-4780, or by email at sales@asap-aviationprocurement.com.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-373-9120 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013739120 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AGAV | END ITEM IDENTIFICATION | DISPLAY CONSO E/I FSCM 49956 |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | 1024-BIT BIPOLAR 256X4) ELECTRICALLY PROGRAMMABLE READ ONLY MEMORY |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM OUTPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MAXIMUM APPLIED |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BIPOLAR AND ELECTRICALLY ALTERABLE AND LOW POWER AND PROGRAMMED AND HIGH RELIABILITY |
CZER | MEMORY DEVICE TYPE | EEPROM |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
ZZZP | PURCHASE DESCRIPTION IDENTIFICATION | 49956-979738-114 |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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