X2N6396X by Freescale Semiconductor Inc with NSN 5961014001651 - Submit a Quote
| Part No. : X2N6396X | Manufacturer : Freescale Semiconductor Inc | NSN : 5961-01-400-1651 |
| Item Name : Semiconductor Device Thyristor | CAGE Code : 04713 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number X2N6396X of NSN 5961014001651 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number X2N6396X is a semiconductor device thyristor manufactured by freescale semiconductor inc under CAGE Code 04713. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. X2N6396X freescale semiconductor inc is in stock.
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NSN Information for Part Number X2N6396X with NSN 5961-01-400-1651, 5961014001651
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-400-1651 Item Description: Semiconductor Device Thyristor | 5961 | 014001651 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| X2n6396x | 5 | 9 | 5 |
Characteristics Data of NSN 5961-01-400-1651, 5961014001651MRC Criteria Characteristic ABHP OVERALL LENGTH 16.89 MILLIMETERS MAXIMUM ABMK OVERALL WIDTH 16.38 MILLIMETERS MAXIMUM ALAZ JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION TO-257AA CTMZ III SEMICONDUCTOR MATERIAL SILICON CTQX CURRENT RATING PER CHARACTERISTIC 12.00 AMPERES FORWARD CURRENT, TOTAL RMS HORSEPOWER METRIC AND 100.00 AMPERES PEAK FORWARD SURGE CURRENT NANOAMPERES CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 125.0 DEG CELSIUS JUNCTION TTQY TERMINAL TYPE AND QUANTITY 3 PIN ABBH INCLOSURE MATERIAL METAL ABKW OVERALL HEIGHT 5.08 MILLIMETERS MAXIMUM AKPV MOUNTING FACILITY QUANTITY 1 AXGY MOUNTING METHOD UNTHREADED HOLE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 200.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE AND 200.0 MAXIMUM REPETITIVE PEAK OFF-STATE VOLTAGE CTRD POWER RATING PER CHARACTERISTIC 20.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR BLANK AND 0.5 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR UNIVERSAL TEST TEST DATA DOCUMENT 82577-H8000313 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 16.89 MILLIMETERS MAXIMUM |
| ABMK | OVERALL WIDTH | 16.38 MILLIMETERS MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-257AA |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 AMPERES FORWARD CURRENT, TOTAL RMS HORSEPOWER METRIC AND 100.00 AMPERES PEAK FORWARD SURGE CURRENT NANOAMPERES |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
| ABBH | INCLOSURE MATERIAL | METAL |
| ABKW | OVERALL HEIGHT | 5.08 MILLIMETERS MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE AND 200.0 MAXIMUM REPETITIVE PEAK OFF-STATE VOLTAGE |
| CTRD | POWER RATING PER CHARACTERISTIC | 20.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR BLANK AND 0.5 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR UNIVERSAL |
| TEST | TEST DATA DOCUMENT | 82577-H8000313 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
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