T1D142N by Harris Graphics Corp Bindery Systemes with NSN 5961011860288 - Submit a Quote
| Part No. : T1D142N | Manufacturer : Harris Graphics Corp Bindery Systemes | NSN : 5961-01-186-0288 |
| Item Name : Semiconductor Devices Unitized | CAGE Code : 91295 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number T1D142N of NSN 5961011860288 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number T1D142N is a semiconductor devices unitized manufactured by harris graphics corp bindery systemes under CAGE Code 91295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. T1D142N harris graphics corp bindery systemes is in stock.
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NSN Information for Part Number T1D142N with NSN 5961-01-186-0288, 5961011860288
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-186-0288 Item Description: Semiconductor Devices Unitized | 5961 | 011860288 | 0 | N | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| T1d142n | 5 | 9 | 3 |
Characteristics Data of NSN 5961-01-186-0288, 5961011860288MRC Criteria Characteristic ABBH INCLOSURE MATERIAL PLASTIC ABHP OVERALL LENGTH 0.770 INCHES MAXIMUM ABJT TERMINAL LENGTH 0.145 INCHES MINIMUM ABKW OVERALL HEIGHT 0.200 INCHES MAXIMUM ABMK OVERALL WIDTH 0.310 INCHES MAXIMUM ASKA COMPONENT NAME AND QUANTITY 4 SEMICONDUCTOR DEVICE DIODE AXGY MOUNTING METHOD TERMINAL CTMZ SEMICONDUCTOR MATERIAL SILICON ALL SEMICONDUCTOR DEVICE DIODE CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 20.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS ALL SEMICONDUCTOR DEVICE DIODE CTQX CURRENT RATING PER CHARACTERISTIC 10.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PEAK ALL SEMICONDUCTOR DEVICE DIODE FEAT SPECIAL FEATURES ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN TTQY TERMINAL TYPE AND QUANTITY 14 PIN
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| ABHP | OVERALL LENGTH | 0.770 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 0.145 INCHES MINIMUM |
| ABKW | OVERALL HEIGHT | 0.200 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.310 INCHES MAXIMUM |
| ASKA | COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PEAK ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PIN |
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