HMC284MS8G by Hittite Microwave Corporation with NSN 5962-01-576-4945 - Submit a Quote

Part Number:  HMC284MS8G
Item Name :  microcircuit linear
CAGE Code:  1CN88
INC Code:  31778

ASAP Aviation Procurement is pleased to announce that part number HMC284MS8G of NSN 5962-01-576-4945 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number HMC284MS8G is a Microcircuit Linear manufactured by Hittite Microwave Corporation under CAGE Code 1CN88. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote. In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea). 

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-and-conditions/. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number HMC284MS8G with NSN 5962-01-576-4945, 5962015764945

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-576-4945

Item PartTypeName:

MICROCIRCUIT,LINEAR

59620157649450NB
CIICHCCESDPMICCriticalityENAC
7BA0
Part NumberISCRNVCRNCCHCCMSDSSADC
HMC284MS8G523

Characteristics Data of NSN 5962-01-576-4945, 5962015764945

MRCCriteriaCharacteristic
CXCYPart Name Assigned By Controlling AgencyLOW STRESS INJECTION MOLDED PLASTIC
MRCDecoded RequirementClear Text Reply
FEATSpecial FeaturesLEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES

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