HM30-028 by Intersil Corporation with NSN 5962004190254 - Submit a Quote
| Part No. : HM30-028 | Alternate P/N: HM30028 | Manufacturer : Intersil Corporation | NSN : 5962-00-419-0254 |
| Item Name : Microcircuit Digital | CAGE Code : 34371 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number HM30-028 of NSN 5962004190254 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number HM30-028 is a microcircuit digital manufactured by intersil corporation under CAGE Code 34371. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. HM30-028 intersil corporation is in stock.
Are you interested in learning more about part number HM30-028? If so, feel free to contact us by phone at +1-714-705-4780, or by email at sales@asap-aviationprocurement.com. And if you are interested in an even faster and more convenient purchasing platform, check out the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number HM30-028 with NSN 5962-00-419-0254, 5962004190254
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-419-0254 Item Description: MICROCIRCUIT,DIGITAL | 5962 | 004190254 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| HM30-028 | 2 | 9 | 5 |
Characteristics Data of NSN 5962-00-419-0254, 5962004190254MRC Criteria Characteristic CZEQ Time Rating Per Chacteristic 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS ADAT Body Width 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM CQZP Input Circuit Pattern 8 INPUT TEST Test Data Document 94990-12-37300B DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) CQSJ Inclosure Material CERAMIC AND GLASS CBBL Features Provided HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED ADAQ Body Length 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU Body Height 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM AEHX Maximum Power Dissipation Rating 450.0 MILLIWATTS CTFT Case Outline Source And Designator T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL AFGA Operating Temp Range -55.0/+125.0 DEG CELSIUS CQSZ Inclosure Configuration FLAT PACK MRC Decoded Requirement Clear Text Reply CQWX Output Logic Form CURRENT-MODE LOGIC
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| ADAT | Body Width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQZP | Input Circuit Pattern | 8 INPUT |
| TEST | Test Data Document | 94990-12-37300B DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSJ | Inclosure Material | CERAMIC AND GLASS |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED |
| ADAQ | Body Length | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | Body Height | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 450.0 MILLIWATTS |
| CTFT | Case Outline Source And Designator | T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQSZ | Inclosure Configuration | FLAT PACK |
| MRC | Decoded Requirement | Clear Text Reply |
| CQWX | Output Logic Form | CURRENT-MODE LOGIC |
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