HM4-65162B4089 by Intersil Corporation with NSN 5962013490265 - Submit a Quote
| Part No. : HM4-65162B4089 | Alternate P/N: HM465162B4089 | Manufacturer : Intersil Corporation | NSN : 5962-01-349-0265 |
| Item Name : Microcircuit Memory | CAGE Code : 34371 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number HM4-65162B4089 of NSN 5962013490265 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number HM4-65162B4089 is a microcircuit memory manufactured by intersil corporation under CAGE Code 34371. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. HM4-65162B4089 intersil corporation is in stock.
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NSN Information for Part Number HM4-65162B4089 with NSN 5962-01-349-0265, 5962013490265
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-349-0265 Item Description: Microcircuit Memory | 5962 | 013490265 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Hm4-65162b4089 | 5 | 2 | 5 |
Characteristics Data of NSN 5962-01-349-0265, 5962013490265MRC Criteria Characteristic ABHP OVERALL LENGTH 0.610 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.185 INCHES NOMINAL ABMK OVERALL WIDTH 0.508 INCHES MAXIMUM ADAQ BODY LENGTH 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM ADAT BODY WIDTH 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -55.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER CQZP INPUT CIRCUIT PATTERN 22 INPUT CTQX CURRENT RATING PER CHARACTERISTIC 70.00 MILLIAMPERES MAXIMUM SUPPLY CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEP CAPITANCE RATING PER CHARACTERISTIC 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM CZEQ TIME RATING PER CHACTERISTIC 90.00 NANOSECONDS MAXIMUM ACCESS CZER MEMORY DEVICE TYPE RAM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 32 J-HOOK AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQSJ INCLOSURE MATERIAL CERAMIC ADAU BODY HEIGHT 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.610 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.185 INCHES NOMINAL |
| ABMK | OVERALL WIDTH | 0.508 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 70.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM ACCESS |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 J-HOOK |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
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