NMC27C16 by National Semiconductor Corp with NSN 5962011913736 - Submit a Quote
| Part No. : NMC27C16 | Manufacturer : National Semiconductor Corp | NSN : 5962-01-191-3736 |
| Item Name : Microcircuit Memory | CAGE Code : 27014 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number NMC27C16 of NSN 5962011913736 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number NMC27C16 is a microcircuit memory manufactured by national semiconductor corp under CAGE Code 27014. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. NMC27C16 national semiconductor corp is in stock.
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NSN Information for Part Number NMC27C16 with NSN 5962-01-191-3736, 5962011913736
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-191-3736 Item Description: Microcircuit Memory | 5962 | 011913736 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Nmc27c16 | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-191-3736, 5962011913736MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.600 INCHES MAXIMUM ADAU BODY HEIGHT 0.160 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.5 WATTS AFGA OPERATING TEMP RANGE +0.0 TO 70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 125.0 DEG CELSIUS CBBL FEATURES PROVIDED HIGH SPEED AND W/TRANSPARENT LID AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 13 INPUT CRHL BIT QUANTITY 16384 CSWJ WORD QUANTITY 2048 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 26.5 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.160 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HIGH SPEED AND W/TRANSPARENT LID AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CRHL | BIT QUANTITY | 16384 |
| CSWJ | WORD QUANTITY | 2048 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 26.5 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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