MM54HC174E 883 by National Semiconductor Corp with NSN 5962012649061 - Submit a Quote
| Part No. : MM54HC174E 883 | Alternate P/N: MM54HC174E883 | Manufacturer : National Semiconductor Corp | NSN : 5962-01-264-9061 |
| Item Name : Microcircuit Digital | CAGE Code : 27014 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number MM54HC174E 883 of NSN 5962012649061 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number MM54HC174E 883 is a microcircuit digital manufactured by national semiconductor corp under CAGE Code 27014. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. MM54HC174E 883 national semiconductor corp is in stock.
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NSN Information for Part Number MM54HC174E 883 with NSN 5962-01-264-9061, 5962012649061
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-264-9061 Item Description: Microcircuit Digital | 5962 | 012649061 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Mm54hc174e 883 | 2 | 1 | 5 |
Characteristics Data of NSN 5962-01-264-9061, 5962012649061MRC Criteria Characteristic ADAQ BODY LENGTH 0.358 INCHES MAXIMUM ADAT BODY WIDTH 0.358 INCHES MAXIMUM ADAU BODY HEIGHT 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 300.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND W/CLEAR AND W/CLOCK CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 8 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 FLIP-FLOP, D-TYPE, CLOCKED CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 39.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 39.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI TTQY TERMINAL TYPE AND QUANTITY 20 LEADLESS ZZZK SPECIFICATION/STANDARD DATA 81349-MIL-M-38510/653 GOVERNMENT SPECIFICATION
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND W/CLEAR AND W/CLOCK |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 FLIP-FLOP, D-TYPE, CLOCKED |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 39.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 39.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/653 GOVERNMENT SPECIFICATION |
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